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    Spark Plasma Sintering (SPS)

    Applications

    • Advanced ceramics
    • Functionally Graded Materials
    • Nano-structural pieces
    • Hard Metals
    • Porous materials
    • Biomaterials
    • Amorphous materials
    • Pieces used in the electronics, optics and electro-optics industries
    • Diamond tools
    • Operating temperature up to 2500
    • Vacuum degree: 5*10-2 mbar
    • Argon/Nitrogen gas entry (and the other gasses, if needed)
    • Pressure application system up to 10 ton
    • Adjustable punch speed and hydraulic force from 0 to 10 ton
    • Punch position control system by accuracy of 100 μm
    • Punch position instantaneous measurement during sintering
    • Double-walled water-cooled stainless steel chamber equipped to self-locked
    • door and sensor and seeing window
    • Easy accessibility for placing and fixing the mold
    • Temperature measurement by thermocouple up to 800°C with automatic arrivals and departures without vacuum breaking
    • Temperature measurement by pyrometer from 800°C to 2500°C with measurability of mold center temperature
    • Pulsed DC power supply with accurate adjustable pulse width on/off (1…780 ms)
    • Increasing heating rate up to 1000 °C/min
    • Induction heating system with cooled-water furnace and adjustable temperature up to 2300°C
    • Usability of induction heating system solely, as an induction vacuum furnace
    • Ability to combine pulsed DC system with induction heating system
    • Ability of automatic arrivals and departures of induction heating system
    • Ability to set all sintering parameters
    • Programmable sintering cycle
    • Fully automatic control of system with programmable central controller and all necessary safeties
    • Commanding and monitoring with touchscreen 10 inch TFT
    • Cooling system to protect the sealing and packing at elevated temperatures

    • Fast sintering
    • No need for initial shaping
    • Sintering of similar and dissimilar materials
    • Easy to use
    • Full density and controlled porosity
    • Low operator cost
    • Forming powders in final or near final shape
    • Minimal grain growth and maintenance of nanometer structure